EKF - Short Profile
EKF - Short Profile

CompactPCI® PlusIO CPU Card

Elkhart Lake Intel® Atom™ x6000RE SoC


Ordering Information

Product Information

Block Diagram

Backplane Resources

Application Notes
Power Event (Power Down)

General Information

Low Profile Mezzanine Modules
S48 | P82

Side Cards (8HP Assy)




Graphics | Ethernet | SATA

Photo Gallery

© EKF • Images show up in a secondary browser tab or window


CompactPCI® PlusIO CPU Card

Low Power Intel® Atom™ x6000RE SoC (Elkhart Lake)

The PC8-FLUTE is a low power CompactPCI® PlusIO CPU board, based on an Intel® Atom™ x6000RE (Elkhart Lake Industrial) System-on-Chip processor. The front panel is provided with three 2.5Gbps RJ45 Ethernet jacks, and three Type-C USB3/DisplayPort connectors. The board is equipped with 16GB directly soldered DDR4 IBECC RAM, and in addition a DDR4 SODIMM socket for another 16GB.

High speed PCIe® x4 SSD mass storage is available via low profile mezzanine modules (4HP assembly), or multi-function side cards (8HP). The PC8-FLUTE backplane connectors comply with the CompactPCI® PlusIO specification, suitable for system expansion with classic CompactPCI® peripheral cards via J1, and in addition high speed I/O such as PCI Express® lanes and 2.5GBASE-T across J2.

PC8-FLUTE • Low Power CPU Board • Photo Soon Here

Feature Summary

  • CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
  • Backplane communication via CompactPCI® PlusIO connectors
  • J1 - PCI® 32bit 66MHz (PICMG® CPCI 2.0)
  • J2 - PCIe®, GbE, SATA, USB (PICMG® CPCI 2.30)
  • On-board PCIe® mezzanine expansion option for mass storage modules or side cards
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

  • Intel® Atom™ Industrial SoC x6000RE Series (Elkhart Lake)
  • x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
  • x6416RE • 4 Cores • 1.7GHz • 9W TDP • 450MHz/16EUs Gfx
  • x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
  • x6214RE • 2 Cores • 1.4GHz • 6W TDP • 400MHz/16EUs Gfx
  • x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx
  • In-band ECC
  • Intel® Programmable Services Engine
  • Intel® Time Coordinate Computing (Intel® TCC) and TSN
  • Operating life 10 years up to 100% active
  • Ta -40°C to 85°C

  • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
  • Fully customizable by EKF
  • Secure Boot and Measured Boot supported
  • Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

Main Memory
  • Integrated memory controller fo up to 32GB DDR4 w. IBECC, 3200MT/s
  • 16GB Soldered memory for rugged applications
  • 16GB SODIMM socket

Mass Storage
  • 128Mbit SPI Flash (UEFI firmware and customer application data)
  • SPI Flash 128Mbit (UEFI firmware and customer application data)
  • PCIe® based SSD module options via P-HSE1 & P-HSE2 mezzanine connectors
  • M.2 socket(s) on low profile mezzanine modules (4HP) or side cards (8HP)
  • Up to 2 x M.2 NVMe SSD size 2280, PCIe x4 (P-HSE1) and PCIe x1 (P-HSE2)
  • Up to 2 x 2TB as of current
  • Option custom specific mezzanine mass storage board design on request

  • Intel® UHD Graphics, 4kp60 (4096x2160@60Hz) on three simultaneous displays
  • 2D/3D Hardware acceleration
  • H.265/HEVC Decode/Encode
  • H.264 Decode/Encode
  • MPEG2 Decode
  • VC1/WMV9 Decode
  • VP8 Decode
  • VP9 Decode/Encode
  • JPEG/MPEG Decode/Encode
  • HDCP 2.3, PAVP
  • 3 x Type-C front panel connectors (DisplayPort Alternate Mode)
  • DisplayPort™ 1.4 MST (multiple displays if monitor is equipped with bridge chip)

  • Up to 9 Multi-Gigabit Ethernet networking interfaces in total
  • 3 x 2500BASE-T RJ45 front ports via SGMII PHYs Marvell® AQR115C
  • 2 x 2500BASE-T backplane J2 connector (P82-GBE low profile mezzanine module - 2 x Intel® I226-IT)
  • Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card - 4 x Intel® I225-IT NIC (8HP assy)
  • TSN Precision time protocol (Time-Sensitive-Networking) as required for OPC UA and OpenAvnu
  • Enables ultra-reliable low-latency communication (URLLC)
  • Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness

EHL SoC I/O Usage
  • 3 x USB Type-C front panel connectors (DP Alt Mode)
  • 3 x 2.5GBASE-T SGMII PHYs to RJ45 front ports
  • 4 x PCIe® Gen3 to HSE1 mezzanine connector (configurable 1x4 or 4x1 links)
  • 4 x PCIe® Gen3 to HSE2 mezzanine connector (4x1 links via Gen3 PCIe® switch)
  • 4 x PCIe® Gen3 to backplane connector J2 (x1 links, via PCIe® switch)
  • PCIe® Gen3 1:5 switch (1 x USB controller, 4 x HSE2 mezzanine)
  • PCIe® Gen3 1:5 switch (PCI® bridge to J1 backplane connector, 4 x PCIe® to J2)
  • 4 x USB2 to J2 backplane connector
  • eSPI, Audio, I2C, UART, CAN-FD, Time Sync to mezzanine expansion connector N-EXP
  • TPM 2.0 module

Additional Building Blocks
  • Additional on-board devices, PCIe® based
  • 2 x PCIe® Gen3 packet switch PI7C9X3G606GP (6-port, 6-lane)
  • Dual port PCIe® USB3 controller uPD720202 (front Type-C, HSE1)
  • PCIeŽ to PCI® bridge PI7C9X112

  • Trusted Platform Module
  • TPM 2.0 for highest level of certified platform protection
  • Infineon Optiga™ SLM9670 cryptographic processor
  • Conforming to TCG 2.0 specification
  • AES hardware acceleration support (Intel® AES-NI)

Front Panel I/O (4HP)
  • 3 x 2.5 Gigabit Ethernet RJ45 (2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te)
  • 3 x DisplayPort (Type-C Alt Mode)
  • 3 x USB 3.0 Type-C (same as DP connectors)
  • 1 x USB 3.0 Type-C in addition w. S48-SSD low profile mezzanine

Front Panel I/O (8HP)
  • Variety of side cards available, common front panel 8HP/12HP with CPU card
  • Various I/O ports e.g. UART, Audio, 2.5G Ethernet)
  • Custom specific front panel and side card design

CompactPCI® (J1) Backplane Resources
  • PICMG® CompactPCI® Classic 32bit 33/66MHz
  • Up to seven CompactPCI® peripheral cards on a classic style or hybrid backplane

CompactPCI® PlusIO (J2) Backplane Resources
  • PICMG® CompactPCI® PlusIO CPU card (system slot controller)
  • Up to four PCIe® based CompactPCI® Serial peripheral cards on a hybrid backplane, Gen1/2/3 x1 links
  • PCIe® based rear I/O module
  • PCIe® links/lanes derived from PI7C9X3G606GP PCIe® Gen3 switch
  • Option 2 x 2.5GBASE-T Gigabit Ethernet via P82-GBE low profile mezzanine module (I226-IT NICs)
  • 1 x SATA derived from EHL SoC
  • 4 x USB2 from EHL SoC

Local Expansion
  • Mezzanine side card connectors for optional local expansion
  • HSE1 - High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
  • HSE2 - High speed expansion connector, PCIe® Gen3 configured 4x1, via PCIe® packet switch
  • N-EXP - Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)
  • 4HP Low profile mezzanine module options (to be ordered separately)
  • S48-SSD Mezzanine Module - 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
  • P82-GBE Mezzanine module - 1 x M.2 2280 NVMe, 2 x backplane (J2) 2.5GbE ports
  • Custom specific module design
  • 8HP Mezzanine side card option (to be ordered separately)
  • SCJ-VEENA Quad RJ45 2.5GbE NIC & M.2 SSD storage
  • PCZ-NVM Dual M.2 NVMe SSD, quad UART
  • Custom specific side card design

Environmental & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
  • Humidity 5% ... 95% RH non Condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF tbd years (MIL-HDBK-217F, SN29500 @+40°C)
  • EC Regulatory EN55035, EN55032, EN62368-1 (CE)

RT OS Board Support Packages & Driver
  • Available on request

  • General low power industrial computing, for x86 based software
  • Rugged systems (e.g. transportation, construction machines, harvester)
  • Data concentrator, router, gateway, kiosk systems, IoT
  • Stand-alone computer (fog computing), scalable via mezzanine I/O expansion options
  • Modular systems with up to 4 CompactPCI® Serial peripheral cards and up to 7 CompactPCI® boards

PC8-FLUTE • Simplified Block Diagram

PC8-FLUTE • Simplified Block Diagram
Ordering Information
Please refer to List 21 for popular SKUs