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Feature Summary
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General
- CompactPCI® PlusIO (PICMG® CPCI 2.30) System Slot Controller
- Form factor single size Eurocard (board dimensions 100x160mm2)
- Mounting height 3U
- Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
- Front panel I/O connectors for typical system configuration (3 x USB3/DisplayPort, 3 x 2.5Gbps Ethernet)
- Backplane communication via CompactPCI® PlusIO connectors
- J1 - PCI® 32bit 66MHz (PICMG® CPCI 2.0)
- J2 - PCIe®, GbE, SATA, USB (PICMG® CPCI 2.30)
- On-board PCIe® mezzanine expansion option for mass storage modules or side cards
- Side cards and low profile mass storage modules available as COTS and also as custom specific
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Processor
- Intel® Atom™ Industrial SoC x6000RE Series (Elkhart Lake)
- x6425RE • 4 Cores • 1.9GHz • 12W TDP • 400MHz/32EUs Gfx
- x6416RE • 4 Cores • 1.7GHz • 9W TDP • 450MHz/16EUs Gfx
- x6414RE • 4 Cores • 1.5GHz • 9W TDP • 400MHz/16EUs Gfx
- x6214RE • 2 Cores • 1.4GHz • 6W TDP • 400MHz/16EUs Gfx
- x6212RE • 2 Cores • 1.2GHz • 6W TDP • 350MHz/16EUs Gfx
- In-band ECC
- Intel® Programmable Services Engine
- Intel® Time Coordinate Computing (Intel® TCC) and TSN
- Operating life 10 years up to 100% active
- Ta -40°C to 85°C
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Firmware
- Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
- Fully customizable by EKF
- Secure Boot and Measured Boot supported
- Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment,
which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'
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Main Memory
- Integrated memory controller fo up to 32GB DDR4 w. IBECC, 3200MT/s
- 16GB Soldered memory for rugged applications
- 16GB SODIMM socket
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Mass Storage
- 128Mbit SPI Flash (UEFI firmware and customer application data)
- SPI Flash 128Mbit (UEFI firmware and customer application data)
- PCIe® based SSD module options via P-HSE1 & P-HSE2 mezzanine connectors
- M.2 socket(s) on low profile mezzanine modules (4HP) or side cards (8HP)
- Up to 2 x M.2 NVMe SSD size 2280, PCIe x4 (P-HSE1) and PCIe x1 (P-HSE2)
- Up to 2 x 2TB as of current
- Option custom specific mezzanine mass storage board design on request
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Graphics
- Intel® UHD Graphics, 4kp60 (4096x2160@60Hz) on three simultaneous displays
- 2D/3D Hardware acceleration
- H.265/HEVC Decode/Encode
- H.264 Decode/Encode
- MPEG2 Decode
- VC1/WMV9 Decode
- VP8 Decode
- VP9 Decode/Encode
- JPEG/MPEG Decode/Encode
- HDCP 2.3, PAVP
- 3 x Type-C front panel connectors (DisplayPort Alternate Mode)
- DisplayPort™ 1.4 MST (multiple displays if monitor is equipped with bridge chip)
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Networking
- Up to 9 Multi-Gigabit Ethernet networking interfaces in total
- 3 x 2500BASE-T RJ45 front ports via SGMII PHYs Marvell® AQR115C
- 2 x 2500BASE-T backplane J2 connector (P82-GBE low profile mezzanine module - 2 x Intel® I226-IT)
- Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card - 4 x Intel® I225-IT NIC (8HP assy)
- TSN Precision time protocol (Time-Sensitive-Networking) as required for OPC UA and OpenAvnu
- Enables ultra-reliable low-latency communication (URLLC)
- Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness
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EHL SoC I/O Usage
- 3 x USB Type-C front panel connectors (DP Alt Mode)
- 3 x 2.5GBASE-T SGMII PHYs to RJ45 front ports
- 4 x PCIe® Gen3 to HSE1 mezzanine connector (configurable 1x4 or 4x1 links)
- 4 x PCIe® Gen3 to HSE2 mezzanine connector (4x1 links via Gen3 PCIe® switch)
- 4 x PCIe® Gen3 to backplane connector J2 (x1 links, via PCIe® switch)
- PCIe® Gen3 1:5 switch (1 x USB controller, 4 x HSE2 mezzanine)
- PCIe® Gen3 1:5 switch (PCI® bridge to J1 backplane connector, 4 x PCIe® to J2)
- 4 x USB2 to J2 backplane connector
- eSPI, Audio, I2C, UART, CAN-FD, Time Sync to mezzanine expansion connector N-EXP
- TPM 2.0 module
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Additional Building Blocks
- Additional on-board devices, PCIe® based
- 2 x PCIe® Gen3 packet switch PI7C9X3G606GP (6-port, 6-lane)
- Dual port PCIe® USB3 controller uPD720202 (front Type-C, HSE1)
- PCIeŽ to PCI® bridge PI7C9X112
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Security
- Trusted Platform Module
- TPM 2.0 for highest level of certified platform protection
- Infineon Optiga™ SLM9670 cryptographic processor
- Conforming to TCG 2.0 specification
- AES hardware acceleration support (Intel® AES-NI)
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Front Panel I/O (4HP)
- 3 x 2.5 Gigabit Ethernet RJ45 (2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te)
- 3 x DisplayPort (Type-C Alt Mode)
- 3 x USB 3.0 Type-C (same as DP connectors)
- 1 x USB 3.0 Type-C in addition w. S48-SSD low profile mezzanine
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Front Panel I/O (8HP)
- Variety of side cards available, common front panel 8HP/12HP with CPU card
- Various I/O ports e.g. UART, Audio, 2.5G Ethernet)
- Custom specific front panel and side card design
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CompactPCI® (J1) Backplane Resources
- PICMG® CompactPCI® Classic 32bit 33/66MHz
- Up to seven CompactPCI® peripheral cards on a classic style or hybrid backplane
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CompactPCI® PlusIO (J2) Backplane Resources
- PICMG® CompactPCI® PlusIO CPU card (system slot controller)
- Up to four PCIe® based CompactPCI® Serial peripheral cards on a hybrid backplane, Gen1/2/3 x1 links
- PCIe® based rear I/O module
- PCIe® links/lanes derived from PI7C9X3G606GP PCIe® Gen3 switch
- Option 2 x 2.5GBASE-T Gigabit Ethernet via P82-GBE low profile mezzanine module (I226-IT NICs)
- 1 x SATA derived from EHL SoC
- 4 x USB2 from EHL SoC
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Local Expansion
- Mezzanine side card connectors for optional local expansion
- HSE1 - High speed expansion connector, PCIe® Gen3 fully configurable, derived from EHL SoC
- HSE2 - High speed expansion connector, PCIe® Gen3 configured 4x1, via PCIe® packet switch
- N-EXP - Sideband expansion connector, e.g. eSPI, Audio, UART (from EHL SoC)
- 4HP Low profile mezzanine module options (to be ordered separately)
- S48-SSD Mezzanine Module - 2 x M.2 2280 NVME SSD sockets, 1 x USB Type-C
- P82-GBE Mezzanine module - 1 x M.2 2280 NVMe, 2 x backplane (J2) 2.5GbE ports
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- Custom specific module design
- 8HP Mezzanine side card option (to be ordered separately)
- SCJ-VEENA Quad RJ45 2.5GbE NIC & M.2 SSD storage
- PCZ-NVM Dual M.2 NVMe SSD, quad UART
- Custom specific side card design
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Environmental & Regulatory
- Designed & manufactured in Germany
- ISO 9001 certified quality management
- Long term availability
- Rugged solution
- Coating, sealing, underfilling on request
- Lifetime application support
- RoHS compliant
- Operating temperature -40°C to +85°C (industrial temperature range)
- Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
- Humidity 5% ... 95% RH non Condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- MTBF tbd years (MIL-HDBK-217F, SN29500 @+40°C)
- EC Regulatory EN55035, EN55032, EN62368-1 (CE)
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RT OS Board Support Packages & Driver
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Applications
- General low power industrial computing, for x86 based software
- Rugged systems (e.g. transportation, construction machines, harvester)
- Data concentrator, router, gateway, kiosk systems, IoT
- Stand-alone computer (fog computing), scalable via mezzanine I/O expansion options
- Modular systems with up to 4 CompactPCI® Serial peripheral cards and up to 7 CompactPCI® boards
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